Company Filing History:
Years Active: 2020-2023
Title: The Innovative Contributions of Lester Joseph Belalo
Introduction
Lester Joseph Belalo is a notable inventor based in Cabuyao, Philippines. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the reliability and efficiency of semiconductor devices through innovative design and manufacturing techniques.
Latest Patents
One of his latest patents is titled "Package with Interlocking Leads and Manufacturing the Same." This invention involves a semiconductor package formed utilizing multiple etching steps, which includes a lead frame, a die, and a molding compound. The lead frame consists of leads and a die pad, both formed from a first conductive material through at least three etching steps. These steps include a first etching step, a second undercut etching step, and a third backside etching step. The second undercut etching step creates interlocking portions at the end of each lead, which are encased in the molding compound. This design allows the interlocking portion to mechanically interlock with the molding compound, preventing lead pull-out. Furthermore, the differential height between the leads and the die pad reduces the span of wires used for electrical connections, minimizing the risk of short circuits.
Career Highlights
Lester Joseph Belalo is currently employed at STMicroelectronics GmbH, where he continues to innovate in the semiconductor industry. His expertise in semiconductor packaging has positioned him as a valuable asset to his company and the field at large.
Collaborations
Throughout his career, Lester has collaborated with talented individuals such as Aaron Cadag and Ela Mia Cadag. These collaborations have contributed to the successful development of his innovative patents.
Conclusion
Lester Joseph Belalo's contributions to semiconductor packaging through his patents demonstrate his commitment to innovation and excellence in engineering. His work not only enhances the functionality of semiconductor devices but also sets a standard for future advancements in the industry.