Leonard G Feinstein

Title: Leonard G Feinstein: Innovator in Semiconductor Packaging

Introduction

Leonard G Feinstein is a notable inventor based in Westborough, MA (US). He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through his innovative patent.

Latest Patents

Feinstein holds a patent for a method of making a semiconductor package. This method involves a lead frame and die sub-assembly that is manufactured using a conventional technique. The process includes bonding a die to the die attach pad of a lead frame and connecting wires between the die and the lead frame fingers. The sub-assembly is then stacked adjacent to a dielectric plastic sheet, which is in turn stacked against a metal heat spreader block. A dollop of uncured resin is dispensed in the gap between the die attach pad and the block. The assembly is compressed between two hot platens, allowing the lead fingers, dielectric sheet, and block to bond together while controlling the thickness of the resin dollop. After the platens are withdrawn, the bonded portion of the lead frame is encapsulated in a thermosetting resin to produce the final semiconductor package.

Career Highlights

Feinstein is currently employed at Allegro Microsystems, LLC, where he continues to innovate in the semiconductor industry. His work has led to advancements in the efficiency and effectiveness of semiconductor packaging techniques.

Collaborations

Throughout his career, Feinstein has collaborated with notable colleagues, including Bela G Nagy and Yehya M Kasem. These partnerships have contributed to the development of cutting-edge technologies in the field.

Conclusion

Leonard G Feinstein's contributions to semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work at Allegro Microsystems, LLC, along with his collaborations, highlights his significant role in the industry.