Raleigh, NC, United States of America

Leon Bildusas

This inventor holds 2 USPTO granted patents. Top assignee: Reichhold Chemicals. Active years: 2000-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Leon Bildusas. Retrieved from https://idiyas.com/inventor/leon-bildusas

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2000-2001

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2 patents (USPTO):Explore Patents

Title: Leon Bildusas: Innovator in Adhesive Technology

Introduction

Leon Bildusas is a notable inventor based in Raleigh, NC (US), recognized for his contributions to adhesive technology. With a total of 2 patents, he has made significant advancements in the packaging of hot melt adhesives.

Latest Patents

His latest patents include a method for packaging a hot melt adhesive mass. This innovative method involves providing a hot melt adhesive with a predetermined viscosity and finite size and shape, which is then encapsulated in a polymeric shrink wrap that forms a hermetic seal. The packaged adhesive mass consists of a hot melt adhesive with specific characteristics, ensuring its integrity and usability.

Career Highlights

Leon Bildusas is currently employed at Reichhold Chemicals, where he continues to develop and refine adhesive technologies. His work has contributed to the efficiency and effectiveness of adhesive products in various applications.

Collaborations

Some of his notable coworkers include Bruce A Waver and David E Mechling, who collaborate with him in advancing adhesive technology.

Conclusion

Leon Bildusas stands out as an innovator in the field of adhesive technology, with his patents reflecting a commitment to improving product packaging and performance. His contributions continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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