Company Filing History:
2 out of 30,045 
2 out of 14,724 
1 out of 1 Years Active: 1990-2003
Title: Innovations of Leo Lorenz
Introduction
Leo Lorenz is a notable inventor based in Neubiberg, Germany. He has made significant contributions to the field of microelectronics, holding a total of 5 patents. His work focuses on innovative methods for producing microelectronic components and power semiconductor arrays.
Latest Patents
One of his latest patents is a method for producing a microelectronic component of sandwich construction. This method involves several steps, including providing a first substrate with a conductor track plane and a plurality of semiconductor chips. The process also includes securing electrically conductive balls to contact points on a second substrate and joining the two substrates together. Another significant patent is for a power semiconductor array on a direct copper bonding (DCB) substrate. This invention aims to eliminate interference emissions propagated via terminal lines directly on the semiconductor device, enhancing its performance and reliability.
Career Highlights
Throughout his career, Leo Lorenz has worked with prominent companies such as Siemens Aktiengesellschaft and Infineon Technologies AG. His experience in these organizations has allowed him to develop and refine his innovative ideas in microelectronics.
Collaborations
Leo has collaborated with notable colleagues, including Heinz Amann and Michael Kaindl. Their combined expertise has contributed to the advancement of technologies in the semiconductor industry.
Conclusion
Leo Lorenz's contributions to microelectronics through his patents and collaborations highlight his role as a significant innovator in the field. His work continues to influence the development of advanced semiconductor technologies.