Wappingers Falls, NY, United States of America

Leo Chin

This inventor holds 1 USPTO granted patent. Top assignee: Solid State Cooling Systems. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Leo Chin. Retrieved from https://idiyas.com/inventor/leo-chin-bg3i0eci

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Innovations by Leo Chin

Introduction

Leo Chin is an accomplished inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of thermal transfer technology. His innovative approach has led to the development of a unique thermal transfer plate that enhances efficiency in thermal management systems.

Latest Patents

Leo Chin holds a patent for a high efficiency thermal transfer plate. This invention provides an effective means for thermal transfer to and from a fluid. More specifically, the thermal transfer plate includes a skived fin plate that improves thermal transfer between the fluid and the plate itself. This innovation is crucial for applications requiring efficient heat exchange.

Career Highlights

Leo Chin is associated with Solid State Cooling Systems, where he applies his expertise in thermal management. His work focuses on developing advanced cooling solutions that meet the demands of modern technology. With a patent portfolio that includes 1 patent, he continues to push the boundaries of innovation in his field.

Collaborations

Leo collaborates with Lloyd F. Wright, leveraging their combined expertise to enhance product development and innovation at Solid State Cooling Systems.

Conclusion

Leo Chin's contributions to thermal transfer technology exemplify the spirit of innovation. His patented solutions are paving the way for more efficient thermal management systems in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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