Stanwood, WA, United States of America

Lenny E Lay


Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 29(Granted Patents)


Location History:

  • Mukilteo, WA (US) (2010)
  • Stanwood, WA (US) (2013 - 2019)

Company Filing History:


Years Active: 2010-2019

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3 patents (USPTO):Explore Patents

Title: Lenny E Lay: Innovator in Adhesive Technology and Conductor Assembly

Introduction

Lenny E Lay is a notable inventor based in Stanwood, WA (US). He has made significant contributions to the field of adhesive technology and conductor assembly, holding a total of 3 patents. His work reflects a commitment to innovation and practical solutions in engineering.

Latest Patents

Lenny's latest patents include an adhesive-bonded attachment device. This device features a mounting base with a mounting surface, a structural adhesive, and a pressure-sensitive adhesive. The design allows for a bonding surface that can securely attach to various structures. Another significant patent is for a conductor assembly and conductor spacer. This invention provides a method for separating conductors while securing them to an underlying platform, enhancing the efficiency of conductor management.

Career Highlights

Lenny E Lay is currently employed at The Boeing Company, where he applies his expertise in engineering and innovation. His work at Boeing has allowed him to contribute to advanced technologies that are crucial in the aerospace industry.

Collaborations

Lenny has collaborated with talented coworkers, including Mark Balderama and Thomas A Holum. These partnerships have fostered a creative environment that encourages the development of innovative solutions.

Conclusion

Lenny E Lay's contributions to adhesive technology and conductor assembly demonstrate his dedication to innovation. His patents reflect a deep understanding of engineering principles and a commitment to improving industry standards.

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