Frisco, TX, United States of America

Lema Kandula

This inventor holds 1 USPTO granted patent. Top assignee: T-Mobile USA, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lema Kandula. Retrieved from https://idiyas.com/inventor/lema-kandula-es5n7qel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Lema Kandula: Inventor in Wireless Telecommunications

Introduction

Lema Kandula is an inventor based in Frisco, Texas, and is associated with T-Mobile USA, Inc. Her work includes an invention that applies artificial intelligence to predict whether a mobile device will join a wireless telecommunications network.

Latest Patents

Kandula is named on 1 patent: “Predicting Whether a Mobile Device Will Join a Wireless Telecommunication Network.” The system evaluates attributes associated with a user equipment (UE), including the age of a lead, a DUNS confidence score, whether the UE has a website, and the source of the UE. The lead age reflects how much time has passed since the UE contacted the network, while the DUNS confidence score indicates the reliability of the UE. The source attribute indicates whether the UE entered the network’s physical premises. An AI system uses these attributes to predict whether the UE will join the network. If the prediction is positive, the system initiates communication with the UE.

Career Highlights

Kandula’s patent describes a data-driven approach to identifying prospective network customers and initiating communication based on an AI-generated prediction. Her listed company affiliation is T-Mobile USA, Inc.

Collaborations

Kandula’s listed coworkers include Amina Noor and Mohammad Mustafa Bari.

Conclusion

Lema Kandula’s patent focuses on using AI to assess customer-related signals and predict whether a mobile device will join a wireless telecommunications network.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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