Oneida, NY, United States of America

Leland Hubert Boyles

This inventor holds 1 USPTO granted patent. Top assignee: Crellin, Inc.. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Leland Hubert Boyles. Retrieved from https://idiyas.com/inventor/leland-hubert-boyles

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Leland Hubert Boyles: Innovator in Fiber Optic Technology

Introduction

Leland Hubert Boyles is a notable inventor based in Oneida, NY (US). He has made significant contributions to the field of fiber optic technology, particularly with his innovative designs that enhance the usability of optical fibers.

Latest Patents

Boyles holds a patent for a "Spool for Fiber Optic Media." This invention consists of two members that lock together to form a drum with two opposed flanges, defining a winding space. The design allows for easy removal of the material wound on the drum, making it reusable after the material is taken off.

Career Highlights

Leland Hubert Boyles has dedicated his career to advancing technology in the fiber optics sector. His work at Crellin, Inc. has positioned him as a key player in the development of practical solutions for handling filamentary materials.

Collaborations

Throughout his career, Boyles has collaborated with talented individuals such as Steven William Pierro and Ronald Tracy Trefzger. These partnerships have contributed to the successful development and implementation of innovative technologies.

Conclusion

Leland Hubert Boyles is a distinguished inventor whose work in fiber optic technology has made a lasting impact. His innovative spool design exemplifies his commitment to enhancing the usability of optical fibers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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