Leina Chan

Title: Leina Chan - Innovator in Chemical Mechanical Planarization

Introduction

Leina Chan is a notable inventor based in Toronto, Canada. She has made significant contributions to the field of chemical mechanical planarization (CMP) through her innovative work. Her expertise and dedication have led to the development of a unique abrasive composition that is beneficial for the semiconductor industry.

Latest Patents

Leina Chan holds a patent for an abrasive composition containing organic particles for chemical mechanical planarization. This invention comprises abrasive particles made from an organic resin, which can be utilized in CMP applications. The composition is an aqueous slurry that maintains a pH range of 2-12. One of the key features of this abrasive composition is its ability to be tailored for selective removal of different components from surfaces. Additionally, it provides efficient polishing rates and excellent surface quality when applied in CMP processes.

Career Highlights

Leina Chan has established herself as a prominent figure in her field, particularly through her work at Dynea Canada Ltd. Her innovative approach to CMP has garnered attention and respect within the industry. With her patent, she has contributed to advancements that enhance the efficiency and effectiveness of semiconductor manufacturing.

Collaborations

Leina has collaborated with talented individuals such as Yuzhuo Li and Guomin Bian. These partnerships have allowed her to further develop her ideas and bring her inventions to fruition.

Conclusion

Leina Chan's contributions to the field of chemical mechanical planarization exemplify her innovative spirit and dedication to advancing technology in the semiconductor industry. Her work continues to influence the way materials are processed and polished, showcasing the importance of innovation in modern manufacturing.