This inventor holds 2 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 2006-2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2006-2008
Title: Lei Li - Innovator in Integrated Circuit Technology
Introduction
Lei Li is a prominent inventor based in Richardson, TX (US), known for his contributions to integrated circuit technology. With a focus on enhancing the performance and reliability of electronic components, he has made significant strides in the field.
Latest Patents
Lei Li holds 2 patents that showcase his innovative approach. His latest patents include a "Structure and method for contact pads having a recessed bondable metal plug over copper-metallized integrated circuits." This invention features a metal structure for an integrated circuit, which has copper interconnecting metallization protected by an overcoat layer. A portion of the metallization is exposed in a window opened through the thickness of the overcoat layer. The design includes a patterned conductive barrier layer positioned on the copper metallization, forming a trough with walls conformal with the overcoat window. The height of the wall is less than the overcoat thickness, creating a step. A plug of bondable metal, preferably aluminum, is positioned in the trough, matching the trough wall height.
Another notable patent is the "Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits." This integrated circuit features copper interconnecting metallization protected by a first inorganic overcoat layer, with portions of the metallization exposed in windows opened through the thickness of the first overcoat layer. A patterned conductive barrier layer is positioned on the exposed portion of the copper metallization and on portions of the first overcoat layer surrounding the window. A bondable metal layer is placed on the barrier layer, suitable for wire bonding, while a second organic overcoat layer surrounds the window, ensuring the surface of this layer is at or above the bondable layer's surface.
Career Highlights
Lei Li is currently employed at Texas Instruments Corporation, where he continues to push the boundaries of integrated circuit design and technology. His work has been instrumental in developing more efficient and reliable electronic components.
Collaborations
Lei collaborates with Edgardo R Hortaleza, contributing to innovative projects and advancements in their field.
Conclusion
Lei Li's contributions to integrated circuit technology through his patents and work at Texas Instruments Corporation highlight his role as a key innovator in the industry. His inventions are paving the way for future advancements in electronic components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
