Beijing, China

Lei Cheng

This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignees: Beijing Boe Display Technology Co., Ltd., Boe Technology Group Co., Ltd.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lei Cheng. Retrieved from https://idiyas.com/inventor/lei-cheng-7verduy9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Lei Cheng - Innovator in Material Pipe and Feeding Systems

Introduction

Lei Cheng is a notable inventor based in Beijing, China. He has made significant contributions to the field of material handling through his innovative designs. His work focuses on enhancing the efficiency and functionality of material pipes and feeding systems.

Latest Patents

Lei Cheng holds a patent for a material pipe and feeding system. The patent describes a system that includes a rotation shaft with an outer thread, a housing with an inner thread and a recess, a fixing member with a through hole, and a positioning assembly. This design aims to improve the handling and feeding of materials in various applications.

Career Highlights

Throughout his career, Lei Cheng has worked with prominent companies such as Boe Technology Group Co., Ltd. and Beijing Boe Display Technology Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas.

Collaborations

Lei Cheng has collaborated with talented individuals, including Xingkai Zhang and Lianzhu Shao, who have contributed to his projects and innovations.

Conclusion

Lei Cheng's contributions to the field of material handling through his patent and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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