Xi'an, China

Lei Cheng


Average Co-Inventor Count = 6.5

ph-index = 1


Location History:

  • Xi'an, CN (2023)
  • Huangshan, CN (2023)

Company Filing History:


Years Active: 2023

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2 patents (USPTO):Explore Patents

Title: Innovations by Inventor Lei Cheng

Introduction

Inventor Lei Cheng, based in Xi'an, China, has made significant contributions to the field of engineering with two notable patents. His innovative approaches focus on improving the reliability and efficiency of complex systems, particularly in sealing structures and photovoltaic cells.

Latest Patents

Lei Cheng's first patent is entitled "Method for evaluating reliability of a sealing structure in a multi-failure mode based on an Adaboost algorithm." This method utilizes the Adaboost algorithm for iterative classification training on seal ring failure data. The process aims to simplify the reliability evaluation, reducing time consumption and enhancing calculation accuracy for multi-failure modes of complex structures. His second patent, "Robust optimal design method for photovoltaic cells," introduces a method that employs the Monte Carlo method to optimize photovoltaic cell designs. It focuses on improving output stability and reliability by selecting appropriate materials and manufacturing techniques based on robust design variables.

Career Highlights

Throughout his career, Lei Cheng has worked with esteemed organizations, including Northwestern Polytechnical University. His research and development efforts have advanced technology in various engineering applications, showcasing his commitment to innovation.

Collaborations

Lei has collaborated with notable colleagues in the field, including Feng Zhang and Xiayu Xu. Together, they have contributed to advancing knowledge and technology, further enhancing the impact of their work.

Conclusion

With his impressive track record of patents and collaborations, Lei Cheng exemplifies the spirit of innovation. His contributions not only address current technological challenges but also pave the way for future advancements in engineering.

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