Oirsbeek, Netherlands

Leendert Smit

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignees: Low & Bonar B.v., Low & Bonar Inc.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Leendert Smit. Retrieved from https://idiyas.com/inventor/leendert-smit

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Leendert Smit: Innovator in Cushioning Structures

Introduction: Leendert Smit is a notable inventor based in Oirsbeek, Netherlands. He has made significant contributions to the field of cushioning structures, showcasing his innovative spirit through his patented designs. With a focus on enhancing comfort and functionality, Smit's work has implications in various industries.

Latest Patents: Leendert Smit holds a patent for a cushioning structure that includes a first layer of a three-dimensional structured mat of extruded entangled filaments. This cushioning structure also features a second layer of a similar mat and an intermediate layer positioned between the two. This innovative design aims to improve the effectiveness and durability of cushioning materials.

Career Highlights: Throughout his career, Smit has worked with prominent companies, including Low & Bonar B.V. and Low & Bonar Inc. His experience in these organizations has allowed him to refine his skills and contribute to the development of advanced cushioning technologies.

Collaborations: Smit has collaborated with talented individuals in his field, including Rolf-Dieter Böttcher and Jeffrey Scott Denton. These partnerships have fostered a creative environment that encourages the exchange of ideas and innovation.

Conclusion: Leendert Smit's contributions to cushioning structures exemplify his dedication to innovation and improvement in material design. His patent and collaborations reflect a commitment to enhancing comfort and functionality in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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