This inventor holds 1 USPTO granted patent. Top assignee: Bonalive Oy. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Leena Hupa: Innovator in Bone Implant Technology
Introduction
Leena Hupa is a prominent inventor based in Abo, Finland. She has made significant contributions to the field of biomedical engineering, particularly in the development of innovative bone implants. Her work focuses on enhancing the effectiveness and biocompatibility of these implants, which are crucial for successful surgical outcomes.
Latest Patents
Leena Hupa holds a patent for a bone implant that features a porous body made from bioactive glass particles. This innovative implant comprises a composition that includes 45-59 weight-% of SiO, 18-25 weight-% of NaO, 17-25 weight-% of CaO, and 0.1-6 weight-% of PO. The implant also includes a biocompatible polymer film, which has a thickness ranging from 10 μm to 200 μm, that is arranged at least partially around the body. This design aims to improve the integration of the implant with the surrounding bone tissue.
Career Highlights
Leena Hupa is associated with Bonalive Oy, a company dedicated to advancing bone healing technologies. Her work at Bonalive Oy has positioned her as a key player in the field of regenerative medicine. With her innovative approach, she has contributed to the development of solutions that address complex medical challenges.
Collaborations
Leena collaborates with talented professionals in her field, including Fredrik Ollila and Nina Lindfors. These collaborations enhance the research and development efforts at Bonalive Oy, fostering an environment of innovation and creativity.
Conclusion
Leena Hupa's contributions to bone implant technology exemplify her commitment to improving patient outcomes through innovation. Her patented work and collaborations reflect her dedication to advancing the field of biomedical engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile