Singapore, Singapore

Lee Yuan Ping


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Innovations of Lee Yuan Ping in Semiconductor Manufacturing

Introduction

Lee Yuan Ping is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor manufacturing. He has developed innovative methods that enhance the efficiency and effectiveness of electrical connections in substrates. His work is particularly significant in the context of reducing gouging during via formation.

Latest Patents

Lee Yuan Ping holds a patent for a method aimed at reducing gouging during via formation. This invention involves a process that begins with forming an opening into a substrate, which extends into the material and terminates at a target for electrical connection. The method includes lining the opening with a specialized liner material that prevents excessive etching of the substrate. This innovative approach ensures that gouging is minimized, thereby improving the integrity of the electrical connections.

Career Highlights

Lee Yuan Ping is associated with Chartered Semiconductor Manufacturing Ltd, a prominent corporation in the semiconductor industry. His work at this company has allowed him to apply his inventive skills in a practical setting, contributing to advancements in semiconductor technology. His patent reflects his commitment to improving manufacturing processes and enhancing product quality.

Collaborations

Lee Yuan Ping has collaborated with notable colleagues, including Daniel Yen and Wei Hua Cheng. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the semiconductor field.

Conclusion

Lee Yuan Ping's contributions to semiconductor manufacturing through his innovative patent demonstrate his expertise and commitment to advancing technology. His work not only addresses current challenges in the industry but also sets the stage for future developments in electrical connection methods.

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