Lee Ting Hsieh

Title: Innovations of Lee Ting Hsieh

Introduction

Lee Ting Hsieh is a notable inventor based in Pingtung, Taiwan. He has made significant contributions to the field of technology, particularly in the development of innovative antenna systems. His work has led to advancements that enhance the performance of electronic devices.

Latest Patents

One of Lee Ting Hsieh's key patents is the "Assembly of chip antenna and circuit board." This invention includes a chip antenna and a circuit board, where the circuit board features a ground layer with a hollow region. This hollow region is strategically formed adjacent to the periphery of the ground layer, allowing for the configuration of the input impedance of the circuit board. The chip antenna is positioned within this hollow region and is electrically connected to the ground layer. The adjustable input impedance of the chip antenna enables a conjugate impedance match between the chip antenna and the circuit board, facilitating simultaneous radiation of electromagnetic energy.

Career Highlights

Lee Ting Hsieh is associated with Inpaq Technology Co., Ltd., where he continues to innovate and develop new technologies. His work has garnered attention for its practical applications in various electronic devices.

Collaborations

Lee has collaborated with talented individuals such as Chih Ming Su and Meng Hsueh Tsai, who contribute to the innovative environment at Inpaq Technology Co., Ltd.

Conclusion

Lee Ting Hsieh's contributions to the field of technology, particularly through his patent on the assembly of chip antennas and circuit boards, highlight his role as a significant inventor. His work continues to influence advancements in electronic device performance.