Swindon, United Kingdom

Lee Smith

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Tyco Electronics UK Ltd. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lee Smith. Retrieved from https://idiyas.com/inventor/lee-smith-hqkrh9z8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Lee Smith - Innovator in Tube-Shaped Object Fixation

Introduction

Lee Smith is a notable inventor based in Swindon, GB. He has made significant contributions to the field of mechanical fixation through his innovative designs. His work focuses on creating practical solutions for everyday challenges.

Latest Patents

Lee Smith holds a patent for a "Tapeless carrier for mechanically fixing tube-shaped objects." This invention features a carrier that includes a body and a prong formed as a unilaterally fixed arm connected to the body at one end. The prong is designed to be folded in a longitudinal direction and has a kink, allowing it to be inserted into a tube-shaped object and mechanically fix it in place. This innovative design simplifies the process of securing tube-shaped items without the need for tape.

Career Highlights

Lee Smith is currently employed at Tyco Electronics UK Ltd, where he continues to develop and refine his inventions. His work at the company has allowed him to collaborate with other professionals in the field, further enhancing his expertise and contributions to innovation.

Conclusion

Lee Smith's inventive spirit and practical solutions have made a significant impact in the realm of mechanical fixation. His patent demonstrates his ability to address real-world problems with innovative designs.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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