This inventor holds 2 USPTO granted patents. Top assignee: Other. Active years: 1993-1994.
Company Filing History:
Years Active: 1993-1994
Title: Innovations by Lee R Weiss
Introduction
Lee R Weiss is a notable inventor based in Pittsburgh, PA (US). He has made significant contributions to the field of three-dimensional printing and layer deposition technologies. With a total of 2 patents, his work has advanced the methods used in creating complex objects through innovative techniques.
Latest Patents
One of his latest patents is titled "Method and support structures for creation of objects by layer deposition." This patent describes an improved support structure that enhances the process of making objects by incrementally building layers of deposition material alongside support material. The structure utilizes a first material and a second material, each with specific melting points to optimize the layering process.
Another significant patent is "Method for fabrication of three-dimensional articles by thermal spray." This method involves using a series of masks with removable liners to form three-dimensional articles through thermal spraying. The process includes layering deposition material in a controlled manner, allowing for the precise creation of complex shapes.
Career Highlights
Throughout his career, Lee R Weiss has focused on developing innovative methods that improve the efficiency and effectiveness of three-dimensional printing technologies. His patents reflect a deep understanding of material properties and the mechanics of layer deposition.
Collaborations
Lee has collaborated with notable colleagues such as Fritz B Prinz and Duane A Adams. Their combined expertise has contributed to the advancement of technologies in the field of additive manufacturing.
Conclusion
Lee R Weiss continues to be a significant figure in the realm of innovation, particularly in the development of methods for three-dimensional object creation. His contributions are paving the way for future advancements in manufacturing technologies.