Tantzu, Taiwan

Lee Ming-Hsun


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Innovations by Lee Ming-Hsun in Semiconductor Technology

Introduction

Lee Ming-Hsun is a notable inventor based in Tantzu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wire bonding processes. His innovative approach has led to the development of a unique patent that addresses critical challenges in semiconductor packaging.

Latest Patents

Lee Ming-Hsun holds a patent for a "System and method for detecting bonding status of bonding wire of semiconductor package." This invention provides schemes associated with the wire bonding process or wire bonding machine to detect the bonding status of a bonding wire in a package that includes at least a semiconductor unit. The patent is particularly beneficial for Ball Grid Array (BGA) packages and similar types, offering significant advantages in scenarios where the resistance between a semiconductor unit and its carrier is not sufficiently low. The invention establishes a preset connection between a semiconductor unit and a package-connection-area at the beginning of the wire bonding process. This connection allows for the formation of a current loop that indicates the bonding status based on the current flowing through it.

Career Highlights

Lee Ming-Hsun is associated with Siliconware Precision Industries, Ltd., a leading company in the semiconductor packaging industry. His work has been instrumental in enhancing the reliability and efficiency of semiconductor packages. His innovative solutions have contributed to the advancement of technology in this critical field.

Collaborations

Lee Ming-Hsun collaborates with Chen Chin-Te, a fellow professional in the semiconductor industry. Their combined expertise fosters innovation and drives advancements in semiconductor technology.

Conclusion

Lee Ming-Hsun's contributions to semiconductor technology through his innovative patent demonstrate his commitment to improving the efficiency and reliability of semiconductor packaging. His work continues to influence the industry positively.

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