Bedford, NH, United States of America

Lee M Mohnkern


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2013-2015

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2 patents (USPTO):Explore Patents

Title: Innovations of Lee M Mohnkern

Introduction

Lee M Mohnkern is an accomplished inventor based in Bedford, NH (US). He has made significant contributions to the field of high-power and high-gain ultra-short gate HEMT devices. With a total of 2 patents, Mohnkern's work showcases his expertise and innovative spirit.

Latest Patents

Mohnkern's latest patents include the development of an asymmetrically recessed high-power and high-gain ultra-short gate HEMT device. This device features exceptional gain and a remarkably high breakdown voltage. The innovation is achieved through an increased width asymmetric recess for the gate electrode, a composite channel layer that includes a thin indium arsenide layer embedded in the indium gallium arsenide channel layer, and double doping facilitated by an additional silicon doping spike. The improved transistor demonstrates an impressive 14 dB gain at 110 GHz and exhibits a high breakdown voltage of 3.5-4 V. This advancement provides high gain, high power, and ultra-high frequency capabilities in an ultra-short gate device.

Career Highlights

Mohnkern is currently employed at BAE Systems Information and Electronic Systems Integration Inc. His work at this esteemed company has allowed him to push the boundaries of technology and contribute to advancements in electronic systems.

Collaborations

Mohnkern has collaborated with notable colleagues, including Dong Xu and Xiaoping S Yang, who is a woman. These collaborations have further enriched his research and development efforts.

Conclusion

Lee M Mohnkern's innovative contributions to high-power and high-gain ultra-short gate HEMT devices highlight his expertise and commitment to advancing technology. His patents reflect a deep understanding of electronic systems and their potential applications.

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