Los Angeles, CA, United States of America

Lee Hendrickson

This inventor holds 7 USPTO granted patents. Top assignee: Sprintray Inc.. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lee Hendrickson. Retrieved from https://idiyas.com/inventor/lee-hendrickson-171ur5e3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 85.7

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2024-2026

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7 patents (USPTO):Explore Patents

Title: Lee Hendrickson: Innovator in 3D Printing Technology

Introduction

Lee Hendrickson is a prominent inventor based in Los Angeles, CA. He has made significant contributions to the field of 3D printing, holding a total of 7 patents. His innovative work has helped advance the capabilities and applications of 3D printing technology.

Latest Patents

Hendrickson's latest patents include a 3D printer platform and a 3D printer cartridge assembly packaging. These inventions reflect his commitment to enhancing the efficiency and functionality of 3D printing systems.

Career Highlights

Hendrickson is currently employed at Sprintray Inc., where he continues to push the boundaries of 3D printing technology. His work at the company has positioned him as a key player in the industry, contributing to the development of cutting-edge solutions.

Collaborations

Hendrickson collaborates with his coworker, Hossein Bassir, to further innovate in the field of 3D printing. Their partnership exemplifies the collaborative spirit that drives technological advancements.

Conclusion

Lee Hendrickson's contributions to 3D printing technology through his patents and work at Sprintray Inc. highlight his role as a leading inventor in this dynamic field. His innovative spirit continues to inspire advancements in 3D printing applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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