Lee Choon Kian

Title: Lee Choon Kian: Innovator in Semiconductor Packaging

Introduction

Lee Choon Kian is a notable inventor based in Singapore, recognized for his contributions to semiconductor packaging technology. He has developed innovative methods that enhance the efficiency and performance of semiconductor devices. His work is particularly significant in the field of board-on-chip (BOC) semiconductor packages.

Latest Patents

Lee holds a patent for a "Method for fabricating BOC semiconductor package." This invention involves a BOC semiconductor package that includes a semiconductor die with die contacts, a substrate bonded circuit side down to the die, and an adhesive layer that bonds the substrate to the die. The substrate features a circuit side with a pattern of conductors and wire bonding sites, along with a back side that has an array of external contacts, such as BGA solder balls. The design allows for reduced loop height of the wires and an overall lower profile of the package, improving planarity and reducing mold bleed during the manufacturing process.

Career Highlights

Lee Choon Kian is currently employed at Micron Technology Incorporated, where he continues to innovate in semiconductor technology. His work has contributed to advancements in the efficiency and reliability of semiconductor packages, making a significant impact in the industry.

Collaborations

Lee has collaborated with notable colleagues, including Chong Chin Hui and Lee Kian Chai, to further enhance the development of semiconductor technologies. Their combined expertise has led to innovative solutions in the field.

Conclusion

Lee Choon Kian is a prominent figure in the semiconductor industry, with a focus on improving packaging methods. His patent for the BOC semiconductor package exemplifies his commitment to innovation and excellence in technology. His contributions continue to shape the future of semiconductor devices.