Lee Cheng

Title: Lee Cheng - Innovator in Connector Assembly Technology

Introduction

Lee Cheng is a notable inventor based in Cupertino, CA. He has made significant contributions to the field of connector assembly technology. His innovative designs have the potential to enhance the functionality and efficiency of electronic devices.

Latest Patents

Lee Cheng holds a patent for a connector assembly with a dimension-reduced transverse wall for easy use. This connector assembly is designed for a unitary daughter board that features different contact pitch arrangements on its lower edge portion. The assembly includes two different contact pitch arrangement connectors that are lengthwise aligned and juxtaposed to commonly receive the lower edge portion of the daughter board. The high-density contact arrangement connector features an outer end wall with a recess at the top, which serves as a pivoting point for the rotative movement of the daughter board without interference. Additionally, the middle partition wall of the connector has a curved surface that conforms to the rotation path of the daughter board.

Career Highlights

Lee Cheng is currently employed at Foxconn International, Inc., where he continues to innovate and develop new technologies. His work at Foxconn has allowed him to collaborate with other talented engineers and contribute to the advancement of electronic components.

Conclusion

Lee Cheng's contributions to connector assembly technology exemplify the spirit of innovation. His patent reflects a deep understanding of engineering principles and a commitment to improving electronic device functionality.