Lee-Cheng Shen

Title: **Innovative Contributions of Inventor Lee-Cheng Shen**

Introduction

Lee-Cheng Shen is a notable inventor based in Hsinchu, Taiwan, who has made significant contributions to the field of electronics with a total of eight patents to his name. His innovations primarily focus on advanced package structures and manufacturing methods that enhance the efficiency and functionality of electronic components.

Latest Patents

One of Lee-Cheng Shen's latest patents is for a package structure comprising a conductive metal board and a ground element. This innovative package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. Specifically, the circuit board features a substrate with a first electronic element mounted on it, while the mold sealing layer encapsulates the electronic element, enhancing protection and functionality. The conductive metal board, positioned on the top surface of the mold sealing layer, works in tandem with the conductive layer affixed to the side surface, ensuring efficient electrical connectivity.

Another recent patent by Shen outlines a comprehensive package structure and the associated manufacturing method. This invention describes a circuit board featuring a substrate divided into molding and non-molding areas, where a component is strategically placed on the molding area. A barrier structure is implemented to demarcate these areas, ensuring precise management of the molding layer, which covers the component effectively.

Career Highlights

Lee-Cheng Shen has had an impactful career, working with esteemed organizations like the Industrial Technology Research Institute and Quanta Computer Incorporated. His roles in these companies allowed him to engage in research and development initiatives that have led to groundbreaking innovations in electronic packaging technologies.

Collaborations

Throughout his career, Shen has collaborated with talented individuals such as Shu-Ming Chang and Chao-Hsuan Wang. These collaborations have fostered a productive environment that promotes innovative thinking and effective problem-solving in the industry.

Conclusion

Lee-Cheng Shen stands out as a prominent inventor whose work continues to influence the field of electronics. With eight patents to his credit, his innovative package structures and methods are paving the way for advancements in electronic component efficiency. As technology evolves, Shen's contributions will undoubtedly play a pivotal role in shaping the future of electronic design and manufacturing.