Tucson, AZ, United States of America

Lee Charles LaFrese

USPTO Granted Patents = 15 

 

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 56(Granted Patents)


Company Filing History:


Years Active: 2008-2019

where 'Filed Patents' based on already Granted Patents

15 patents (USPTO):

Title: Innovations of Lee Charles LaFrese

Introduction

Lee Charles LaFrese is a prominent inventor based in Tucson, AZ, known for his significant contributions to technology. With a remarkable portfolio of 15 patents, LaFrese has made strides in the field of storage systems and microcode upgrades. His work reflects a commitment to enhancing system performance and reliability.

Latest Patents

One of LaFrese's latest patents focuses on a method for upgrading microcode in a multi-module storage system. This innovative approach involves selecting a first module from multiple modules and operating it with upgraded microcode. The method includes monitoring the performance of the first module by a second module and providing an indication of its performance. Additionally, it determines whether the performance meets a specified metric, showcasing LaFrese's dedication to improving technological efficiency.

Career Highlights

LaFrese has built a successful career at International Business Machines Corporation (IBM), where he has been instrumental in developing advanced storage solutions. His expertise in microcode and system performance has positioned him as a key player in the tech industry.

Collaborations

LaFrese has worked alongside talented colleagues, including Michael T Benhase and Lokesh M Gupta. Their collaborative efforts have contributed to the success of various projects and innovations within the company.

Conclusion

Lee Charles LaFrese's contributions to technology through his patents and work at IBM highlight his role as a leading inventor in the field. His innovative methods for upgrading microcode in storage systems demonstrate his commitment to advancing technology and improving system performance.

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