Foothill Ranch, CA, United States of America

Lee Burgess

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Ennovi Industries, Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lee Burgess. Retrieved from https://idiyas.com/inventor/lee-burgess

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024

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2 patents (USPTO):Explore Patents

Title: Lee Burgess: Innovator in Cable Connector Technology

Introduction

Lee Burgess is a notable inventor based in Foothill Ranch, CA (US). He has made significant contributions to the field of cable connector technology, holding a total of 2 patents. His work is characterized by a commitment to innovation and practical solutions.

Latest Patents

Among his latest patents is the "Strain relief for a cable connector." This invention addresses the common issues faced with cable connectors, enhancing their durability and functionality. The focus on strain relief is crucial for ensuring that cables remain intact and operational under various conditions.

Career Highlights

Lee Burgess is currently employed at Ennovi Industries, Inc., where he continues to develop and refine his inventions. His role at the company allows him to collaborate with other talented professionals in the industry, further advancing the field of cable technology.

Collaborations

Lee has worked alongside notable colleagues such as Adam Factor and David Salomon. Their combined expertise fosters a creative environment that encourages innovative solutions and advancements in technology.

Conclusion

Lee Burgess exemplifies the spirit of innovation in the field of cable connector technology. His contributions, particularly in strain relief mechanisms, highlight his dedication to improving product reliability and performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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