This inventor holds 1 USPTO granted patent. Top assignee: Basf Se Corporation. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: Lee Ann Dombrowski: Innovator in Electronic Component Encapsulation
Introduction
Lee Ann Dombrowski is a notable inventor based in Chesterfield Township, MI (US). She has made significant contributions to the field of electronic component encapsulation. Her innovative approach has led to the development of a unique method that enhances the durability and functionality of electronic assemblies.
Latest Patents
Dombrowski holds a patent for a "Method of encapsulating an electronic component." This patent describes an encapsulated electronic assembly that comprises an electronic component and a foamed thermoplastic shell. The foamed thermoplastic shell is formed from a thermoplastic encapsulant, which includes a thermoplastic resin and a filler, and is foamed with a foaming agent. The method involves melting the thermoplastic encapsulant, foaming it, and then injection molding the foamed thermoplastic encapsulant around the electronic component to create the shell.
Career Highlights
Lee Ann Dombrowski is currently employed at BASF SE Corporation, where she continues to innovate in her field. Her work focuses on improving electronic component protection through advanced encapsulation techniques. Dombrowski's dedication to her craft has positioned her as a key player in the industry.
Collaborations
Throughout her career, Dombrowski has collaborated with talented individuals such as Inga Marie Balke and Harold Colwell. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Lee Ann Dombrowski's contributions to the field of electronic component encapsulation demonstrate her innovative spirit and commitment to enhancing technology. Her patent and work at BASF SE Corporation reflect her significant impact on the industry.