Plano, TX, United States of America

Leatrice Lea Gallman Adams


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: **Inventor Spotlight: Leatrice Lea Gallman Adams**

Introduction

Leatrice Lea Gallman Adams is an innovative inventor based in Plano, TX, known for her significant contributions to the field of electronics. With a focus on enhancing thermal management in packaged electronic devices, her work has paved the way for improved device performance and longevity. She is currently affiliated with Texas Instruments Corporation, where she applies her expertise to develop cutting-edge technology.

Latest Patents

Leatrice holds one patent titled "Thermal conduction by encapsulation." This invention revolves around a novel design for a packaged electronic device that includes a substrate interrupted by a well. The device features a trench defined by the substrate bottom surface, substrate sidewall, and device sidewall, filled with an encapsulant that ensures optimal thermal conduction. The unique design of the encapsulant allows for distinct elevations on the substrate and device sidewalls, enhancing the overall efficiency of electronic devices.

Career Highlights

During her career at Texas Instruments Corporation, Leatrice has demonstrated exceptional skills in the field of electronics engineering. Her innovative approach and dedication to research have allowed her to make substantial contributions in developing solutions that address thermal management challenges in electronic devices.

Collaborations

Leatrice has had the opportunity to work closely with talented colleagues, including Jane Qian Liu and Frank Odell Armstrong. These collaborations have fostered a dynamic environment at Texas Instruments Corporation, allowing for the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Leatrice Lea Gallman Adams is a remarkable inventor whose patent on thermal conduction encapsulation exemplifies the intersection of creativity and engineering. Her work continues to impact the electronic device industry, showcasing the importance of innovation in driving technology forward. As she continues to collaborate with her peers at Texas Instruments Corporation, the potential for future advancements in electronic device design remains promising.

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