The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2011

Filed:

Nov. 05, 2008
Applicants:

Jane Qian Liu, Plano, TX (US);

Frank Armstrong, Wylie, TX (US);

Edward Carl Fisher, Lucas, TX (US);

Scott Patrick Overmann, Allen, TX (US);

Leatrice Lea Gallman Adams, Plano, TX (US);

Inventors:

Jane Qian Liu, Plano, TX (US);

Frank Armstrong, Wylie, TX (US);

Edward Carl Fisher, Lucas, TX (US);

Scott Patrick Overmann, Allen, TX (US);

Leatrice Lea Gallman Adams, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A packaged electronic device includes a substrate with an upper surface interrupted by a well formed in the substrate. The well has a substrate bottom surface and a substrate sidewall. An electronic device is located in the well over the substrate bottom surface and has a device top surface and a device sidewall. A trench is bounded by the substrate bottom surface, the substrate sidewall and the device sidewall. An encapsulant at least partially fills the trench and contacts the substrate sidewall and the device sidewall. The encapsulant has a first elevation on the substrate sidewall with respect to the substrate bottom surface and a second elevation on the substrate device sidewall with respect to the substrate bottom surface that is at least about 35% greater than the first elevation.


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