Endicott, NY, United States of America

Leann G Keim

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1992-1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Leann G Keim. Retrieved from https://idiyas.com/inventor/leann-g-keim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 1992-1993

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2 patents (USPTO):Explore Patents

Title: Leann G Keim: Innovator in Microelectronic Packaging

Introduction

Leann G Keim is a notable inventor based in Endicott, NY (US). She has made significant contributions to the field of microelectronics, particularly in the area of circuitization on polyimide substrates. With a total of 2 patents, her work has advanced the technology used in microelectronic packaging.

Latest Patents

One of her latest patents is titled "Gold plating bath additives for copper circuitization on polyimide." This patent discloses a method for fabricating a microelectronic package that features gold-plated copper circuitization on a polyimide substrate. The method involves forming a pattern of copper circuitization on selected portions of the polyimide substrate and depositing a gold thin film on the copper circuitization layer. The gold thin film is electrodeposited from a solution modified with an effective amount of NH₄⁺.

Another significant patent is the "Electrolytic method for forming vias and through holes." This invention describes a method for fabricating a microelectronic package with a Cu-Invar-Cu core encapsulated between dielectric films. The process includes contacting the copper within the core with a copper etching solution while maintaining the copper anodic, converting it to soluble copper oxides. Additionally, the Invar is electrolytically etched to form soluble iron and nickel chlorides.

Career Highlights

Leann G Keim is currently employed at International Business Machines Corporation (IBM), where she continues to innovate in the field of microelectronics. Her work has been instrumental in developing advanced methods for microelectronic packaging.

Collaborations

Throughout her career, Leann has collaborated with notable coworkers, including Ralph S Paonessa and Krystyna Waleria Semkow. These collaborations have contributed to her success and the advancement of technology in her field.

Conclusion

Leann G Keim is a pioneering inventor whose work in microelectronic packaging has led to significant advancements in the industry. Her patents reflect her innovative spirit and dedication to improving technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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