This inventor holds 1 USPTO granted patent and 1 published patent application, plus 1 CIPO patent. Top assignee: Sonoco Development Incorporated. Active years: 2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2012
Title: Lea Wayne - Innovator in Flexible Packaging Solutions
Introduction
Lea Wayne is a notable inventor based in Downers Grove, IL (US). She has made significant contributions to the field of flexible packaging, particularly with her innovative designs that enhance user experience. Her work focuses on creating packaging solutions that are not only functional but also user-friendly.
Latest Patents
Lea Wayne holds a patent for a "Pouch opening feature and method for making the same." This invention involves a flexible packaging structure that incorporates built-in opening features within a laminate. The design includes a tear area formed by laser ablation along the junction of two structures, allowing for easy access to the package contents. The laser ablation process begins at the center of the tear area and moves outward, ensuring a precise and effective opening mechanism. Additionally, a score line and sealant reduction area are introduced to facilitate the opening process.
Career Highlights
Lea Wayne is currently employed at Sonoco Development Incorporated, where she continues to innovate in the packaging industry. Her work has garnered attention for its practicality and effectiveness, making her a valuable asset to her company and the field at large.
Collaborations
Throughout her career, Lea has collaborated with talented individuals such as John A Prizzi and Barry Roland Reese. These partnerships have contributed to her success and the advancement of her projects.
Conclusion
Lea Wayne's contributions to flexible packaging through her innovative patent demonstrate her commitment to improving user experience in packaging solutions. Her work continues to influence the industry and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile