Sunnyvale, CA, United States of America

Lea-Teng Lee

USPTO Granted Patents = 3 

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2017-2018

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3 patents (USPTO):Explore Patents

Title: Innovations by Inventor Lea-Teng Lee in Printed Circuit Board Technology

Introduction

Lea-Teng Lee, an inventive mind based in Sunnyvale, CA, has made significant contributions to the field of printed circuit board (PCB) technology. With a total of three patents to his name, Lee's latest inventions focus on enhancing the protection and efficiency of electronic components.

Latest Patents

Lea-Teng Lee's patented innovations include:

1. **Module with external shield and back-spill barrier for protecting contact pads**: This module encompasses a printed circuit board (PCB) featuring a substrate and component pads on its surface. An external shield is designed to guard at least one component against electromagnetic radiation, while a back-spill barrier effectively prevents the external shield from contacting the contact pads.

2. **Method of attaching components to printed circuit board with reduced accumulated tolerances**: This method introduces a technique for attaching components to PCB pads by dividing the accumulated tolerances across multiple processes. It involves utilizing two stencils in separate processes, leading to improved precision and reliability in solder joints between components and pads.

Career Highlights

Lea-Teng Lee's work is primarily associated with Avago Technologies General IP (Singapore) Pte. Ltd., where he continues to support advancements in electronics and materials science. His innovative approaches have contributed to the efficiency and performance of electronic devices.

Collaborations

Throughout his career, Lea-Teng Lee has collaborated with distinguished colleagues such as Sarah Kay Haney and Deog Soon Choi. These partnerships have fostered a dynamic exchange of ideas and facilitated the development of groundbreaking technologies in PCB applications.

Conclusion

Inventor Lea-Teng Lee has established himself as a key figure in the innovation of printed circuit board technology. With his three patents highlighting advanced methods and protective measures for electronic components, he continues to influence the industry positively. His collaborative efforts further enhance the potential for future innovations in the field.

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