The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Mar. 24, 2016
Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;
Sarah Haney, San Jose, CA (US);
Deog Soon Choi, Seoul, KR;
Hyun Mo Ku, Seoul, KR;
Lea-Teng Lee, Sunnyvale, CA (US);
Nitesh Kumbhat, San Jose, CA (US);
Ah Ron Lee, Seoul, KR;
Avago Technologies General IP (Singapore) Pte. Ltd., Singapore, SG;
Abstract
A module includes a printed circuit board (PCB) having a substrate, component pads on a top surface of the substrate, and contact pads formed on a bottom surface of the substrate. The module further includes a mold compound disposed over the PCB; an external shield disposed over a top surface of the mold compound and on side surfaces of the mold compound and the PCB, where the external shield is configured to provide shielding of at least one component connected to at least one component pad from electromagnetic radiation; and a back-spill barrier formed on the bottom of the substrate. The back-spill barrier surrounds the contact pads, and is configured to prevent the external shield from making contact with the contact pads.