Edgerton, KS, United States of America

Lea A Rempel

This inventor holds 1 USPTO granted patent. Top assignee: University of Wyoming. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lea A Rempel. Retrieved from https://idiyas.com/inventor/lea-a-rempel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents
Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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