Company Filing History:
Years Active: 2016-2020
Title: Layal Rouhana: Innovator in Integrated Circuit Packaging
Introduction
Layal Rouhana is a prominent inventor based in San Diego, CA, known for her contributions to the field of integrated circuit packaging. With a total of 4 patents to her name, she has made significant strides in developing innovative solutions that enhance the performance and efficiency of electronic devices.
Latest Patents
One of her latest patents is for a low profile integrated package. This package includes a substrate comprising an interposer interconnect and a cavity, along with a redistribution portion that is coupled to the substrate. The redistribution portion features a plurality of redistribution interconnects and a first die that is coupled to the redistribution portion through the cavity of the substrate. Notably, a substantial region between a side surface of the first die and the substrate is free of an encapsulation layer. In some implementations, the substrate is designed without a metal ring surrounding the first die. Additionally, the redistribution portion may include a barrier layer and a first interconnect that is coupled to the barrier layer, which in turn is connected to the interposer interconnect.
Another significant patent involves an integrated circuit (IC) package and package substrate comprising stacked vias. This device includes a semiconductor die and a package substrate that is coupled to the semiconductor die. An encapsulation layer partially encapsulates the semiconductor die. The package substrate features at least one stacked via, which consists of a first via and a second via that is coupled to the first via. The second via has a different shape than the first via and includes a seed layer that is coupled to the first via. The package substrate also incorporates a prepreg layer, along with a first pad coupled to the first via and a second pad coupled to the second via.
Career Highlights
Layal Rouhana is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. Her work focuses on advancing technologies that are crucial for modern electronic devices.
Collaborations
Throughout her career, Layal has collaborated with talented individuals such as Houssam Jomaa and Kuiwon Kang, contributing to a dynamic and innovative work environment.
Conclusion
Layal Rouhana's contributions to integrated circuit packaging demonstrate her expertise and commitment to innovation in the field. Her patents reflect a deep understanding of technology and a drive to improve electronic device performance.