Lay Yeap Lim

Title: Innovations of Lay Yeap Lim

Introduction

Lay Yeap Lim is a notable inventor based in Batu Berendam, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and functionality of electronic components.

Latest Patents

One of his latest patents is related to strip testing of semiconductor devices. This innovation involves a strip of semiconductor devices that includes multiple leadframes, which are electrically isolated from each other. Each leadframe has a first surface and a second surface opposite to the first surface. At least one semiconductor chip is electrically coupled to the first surface of each leadframe, and the encapsulation material surrounds each semiconductor chip and portions of each leadframe.

Another significant patent is for an electric component with an electrophoretically deposited film. This system comprises a component carrier and a component disposed on the carrier. An insulating layer is placed on an electrically conductive surface of either the component carrier or the component. The insulating layer consists of a polymer and an inorganic material, which provides a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K.

Career Highlights

Lay Yeap Lim is currently employed at Infineon Technologies AG, where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced technologies that improve electronic devices.

Collaborations

He has collaborated with notable coworkers such as Nee Wan Khoo and Sung Hoe Yeong, contributing to various projects that enhance the capabilities of semiconductor devices.

Conclusion

Lay Yeap Lim's contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the field. His innovations continue to impact the industry positively.