Company Filing History:
Years Active: 1981-1984
Title: Innovations by Lawrence M Rubin
Introduction
Lawrence M Rubin is a notable inventor based in Coatesville, PA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work primarily focuses on high-speed wire bonding methods, which are essential for the efficient manufacturing of electronic components.
Latest Patents
Rubin's latest patents include a "Wire Bonding Apparatus" and a "High Speed Wire Bonding Method." The Wire Bonding Apparatus patent describes a method for high-speed bonding of fine wires to electrodes. This method involves teaching the wire bonding tool the exact point of engagement with the semiconductor. It calculates a tolerance inflection point, which represents where the bonding tool must start a constant velocity approach to the first bonding position. The bonding tool is then accelerated toward the bonding position with optimum speed, avoiding any potential crashes into the semiconductor.
The High Speed Wire Bonding Method patent outlines a processor-controlled wire bonder that positions the bonding tool over an electrode on a semiconductor. The bonding tool is accelerated toward the electrode, and shortly before engagement, it moves at a linear predetermined velocity. This process imparts controlled kinetic energy to the wire as a first bonding force, followed by a second predetermined preload bonding force at the time of engagement, and a final bonding force to secure the fine wire to the electrode at high speeds.
Career Highlights
Lawrence M Rubin is currently associated with Kulicke and Soffa Industries, Inc., a company renowned for its advanced semiconductor packaging and assembly solutions. His innovative approaches have significantly enhanced the efficiency and reliability of wire bonding processes in the semiconductor industry.
Collaborations
Rubin has collaborated with notable colleagues such as Glenn B Bilane and Albert Soffa, contributing to the advancement of technology in their field.
Conclusion
Lawrence M Rubin's contributions to high-speed wire bonding technology have made a lasting impact on the semiconductor industry. His innovative patents and collaborative efforts continue to drive advancements in electronic manufacturing processes.