The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 1981

Filed:

Nov. 22, 1978
Applicant:
Inventors:

Glenn B Bilane, Huntington Valley, PA (US);

Lawrence M Rubin, Coatesville, PA (US);

Albert Soffa, Wynnewood, PA (US);

Dan Vilenski, Hatboro, PA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228-45 ; 228 / ; 228-7 ; 228-8 ; 74 43 ; 219 561 ;
Abstract

An apparatus for bonding wires on semiconductors is provided with a processor controlled vertical drive mechanism coupled to a novel bonding head of the type having a bonding tool mounted therein. The height of the bonding tool at the reset position and at the bonding position may be programmed into the processor for different semiconductor devices or workpieces. Indicating means are provided on the novel bonding head for establishing the reset position and the bonding positions so that the bonding tool is taught a series of predetermined vertical positions during a bonding cycle. The apparatus is also programmed to compute intermediate positions between said predetermined vertical positions to obtain optimum high speed movement of the bonding head and the bonding tool during subsequent bonding cycles.


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