This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Lam Research Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: The Innovative Contributions of Lawrence Kingrey
Introduction
Lawrence Kingrey is a notable inventor based in Oregon City, OR (US). He has made significant contributions to the field of technology, particularly in the area of substrate handling. His innovative work has led to the development of a patented apparatus that addresses critical challenges in substrate support and handling.
Latest Patents
Kingrey holds a patent for a device titled "Substrate Sticking and Breakage Mitigation." This invention features a substrate contact-ring designed to support a substrate effectively. The apparatus includes a peripheral structure that is specifically sized and configured to hold the substrate securely. The design incorporates a substantially flat ring-section along with a spaced array of contact fingers that are mechanically coupled to the ring-section. These contact fingers are resiliently movable, allowing them to engage the edge of the substrate when it is being supported or removed. This innovative mechanism enhances the reliability of substrate handling, reducing the risk of sticking and breakage.
Career Highlights
Lawrence Kingrey is currently employed at Lam Research Corporation, where he continues to contribute to advancements in technology. His work at Lam Research has positioned him as a key player in the development of innovative solutions for substrate handling in various applications.
Collaborations
Throughout his career, Kingrey has collaborated with talented individuals such as Aaron Berke and John Floyd Ostrowski. These collaborations have fostered an environment of innovation and creativity, leading to the successful development of new technologies.
Conclusion
Lawrence Kingrey's contributions to the field of substrate handling through his patented inventions demonstrate his commitment to innovation. His work not only addresses existing challenges but also paves the way for future advancements in technology.
