Nichols, NY, United States of America

Lawrence J Hugaboom

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1986.


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 1986

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1 patent (USPTO):Explore Patents

Title: The Innovations of Lawrence J Hugaboom

Introduction

Lawrence J Hugaboom is a notable inventor based in Nichols, NY (US). He has made significant contributions to the field of printed circuit technology. His innovative approach has led to the development of a unique patent that addresses critical issues in circuit manufacturing.

Latest Patents

Hugaboom holds a patent for "Glass cloth for printed circuits and method of manufacture wherein yarns." This invention focuses on woven glass cloth and its manufacturing process, which is suitable for use as a resin-impregnated substrate for printed circuits. The patent highlights the importance of the dimensions of the yarns used in the cloth, particularly how the major dimension of the elliptical warp yarns exceeds a predetermined fraction of that of the fill yarns. This design helps to prevent voids that can lead to circuit failures when filled with materials other than resin.

Career Highlights

Hugaboom has had a distinguished career at International Business Machines Corporation (IBM). His work has been instrumental in advancing the technology used in printed circuits. His innovative solutions have contributed to the reliability and efficiency of electronic devices.

Collaborations

Throughout his career, Hugaboom has collaborated with talented individuals such as Anilkumar Chinuprasad Bhatt and Michael J Cibulsky. These collaborations have fostered an environment of innovation and creativity, leading to advancements in their respective fields.

Conclusion

Lawrence J Hugaboom's contributions to the field of printed circuits exemplify the impact of innovation in technology. His patent addresses significant challenges in circuit manufacturing, showcasing his expertise and dedication to advancing the industry.

Profile summary based on public USPTO records.
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