Company Filing History:
Years Active: 2013-2015
Title: Law Wai Ling: Innovator in Wire Bonding Technology
Introduction
Law Wai Ling, an accomplished inventor located in Ipoh, Malaysia, has made significant contributions to the field of semiconductor packaging. With four patents to his name, his work focuses primarily on advancements in wire bonding technology, which is essential in connecting semiconductor dies for multi-die packages.
Latest Patents
Among his latest innovations are two notable patents involving wire bonding techniques. The first patent, titled "Short and Low Loop Wire Bonding," details a multi-die package that features a first and a second semiconductor die, each equipped with a plurality of bond pads. This design allows the upper surfaces of the dies to be nearly coextensive, enabling efficient connections through bonding wires. A unique aspect of this invention is the kink in the bonding wire, allowing for better spatial management and performance.
The second patent, "Low Loop Wire Bonding," describes a similar multi-die package, but introduces a bonding wire that extends upward along the z-axis before curving outward towards the first semiconductor die. This innovative technique enhances the reliability and efficiency of the bonding process between the semiconductor dies, contributing to improved overall package performance.
Career Highlights
Law Wai Ling is currently employed with Carsem (M) Sdn. Bhd., a renowned company specializing in semiconductor packaging solutions. His expertise in wire bonding technology has helped the company solidify its position in the market, driving forward innovative practices in semiconductor assembly. His contributions to the field through his patents affirm his status as a leading inventor in the industry.
Collaborations
Working alongside his coworker Liew Siew Har, Law Wai Ling has fostered a collaborative environment that encourages the sharing of ideas and advancements within the domain of semiconductor technology. Their teamwork has not only facilitated the patenting of new technologies but also boosted Carsem's reputation as a pioneer in semiconductor innovation.
Conclusion
Law Wai Ling’s inventive spirit and dedication to improving wire bonding techniques highlight his significant role in advancing semiconductor packaging. His four patents serve as a testament to his innovative contributions within the industry, and his collaborative efforts with colleagues further illustrate the importance of teamwork in driving technological advancements. As he continues to work with Carsem (M) Sdn. Bhd., the future looks promising for further innovations from Law Wai Ling.