Lauriann T Carney

Title: Lauriann T Carney: Innovator in Semiconductor Technology

Introduction

Lauriann T Carney is a notable inventor based in Gilbert, AZ (US). She has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. Her work focuses on improving the efficiency and functionality of electronic packages.

Latest Patents

One of her latest patents is for a "Leadframe assembly for conducting thermal energy from a semiconductor." This invention involves a semiconductor die that is placed on a heat sink within an electronic package. During the assembly process, a leadframe is connected to the heat sink using down-set tabs that are strategically offset. This design allows for individual heat sinks to be pre-out prior to the molding of the final packages. Another significant patent is for a "Lead frame assembly for surface mount integrated circuit power package." This invention features a lead frame that houses an integrated circuit, with leads extending from multiple sides. The design includes a transition region that allows for alignment with lead frame handling equipment, enhancing manufacturing efficiency.

Career Highlights

Lauriann T Carney is currently employed at Motorola Corporation, where she continues to innovate in the semiconductor space. Her work has been instrumental in advancing technologies that are critical to modern electronics.

Collaborations

Throughout her career, Lauriann has collaborated with notable colleagues, including William M Strom and Timothy Lee Olson. These partnerships have contributed to her success and the development of her innovative patents.

Conclusion

Lauriann T Carney is a pioneering inventor whose work in semiconductor technology has led to significant advancements in electronic packaging. Her contributions continue to impact the industry positively.