Milan, Italy

Laura Bacci


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 95(Granted Patents)


Company Filing History:


Years Active: 1997-1998

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2 patents (USPTO):Explore Patents

Title: Laura Bacci: Innovator in Semiconductor Technology

Introduction

Laura Bacci is a prominent inventor based in Milan, Italy. She has made significant contributions to the field of semiconductor technology, particularly in improving the adhesion between dielectric materials. With a total of 2 patents, her work has been instrumental in advancing manufacturing processes in this critical area.

Latest Patents

Laura Bacci's latest patents focus on methods for enhancing the interface union among dielectric materials. One of her notable inventions is a process for improved adhesion between dielectric material layers during the manufacture of semiconductor devices. This method involves forming a first layer of dielectric material, specifically silicon oxynitride or silicon nitride, on a circuit structure defined on a semiconductor substrate. Subsequently, a second layer of dielectric material is formed over the first layer, with a thin oxide layer interposed to serve as an adhesion layer between the two superimposed layers.

Career Highlights

Laura Bacci has established herself as a key figure in her field through her innovative approaches and technical expertise. She works at SGS-Thomson Microelectronics S.r.l., where she continues to develop cutting-edge solutions for semiconductor manufacturing. Her contributions have not only advanced her company’s capabilities but have also set new standards in the industry.

Collaborations

Throughout her career, Laura has collaborated with talented professionals, including Maurizio Bacchetta and Luca Zanotti. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Laura Bacci is a remarkable inventor whose work in semiconductor technology has made a lasting impact. Her patents reflect her dedication to improving manufacturing processes and enhancing the performance of semiconductor devices. Through her career, she continues to inspire future innovations in the field.

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