This inventor holds 2 USPTO granted patents. Top assignee: Hollister, Inc.. Active years: 1997-1998.
Company Filing History:
Years Active: 1997-1998
Title: Innovations by Larry R DeCamp
Introduction
Larry R DeCamp is a notable inventor based in Wauconda, IL (US). He has made significant contributions to the field of adhesive technology, particularly in the development of innovative wafer designs. With a total of 2 patents to his name, DeCamp's work has had a meaningful impact on the industry.
Latest Patents
DeCamp's latest patents include a method of making a wafer having an adhesive skin barrier layer. This invention features a thin barrier layer of soft, pliant adhesive material with particles of one or more hydrocolloids dispersed within it. A flexible and preferably stretchable cover layer extends along one side of the barrier layer, while a removable release sheet protects the opposite side. The wafer is designed with a central zone and a relatively large outer zone surrounding it. The material in the outer zone exhibits generally uniform molecular orientations in radial directions over an arc of 360 degrees, ensuring relatively uniform tensile strength in all such radial directions. Additionally, the patent discloses injection/compression molding methods for producing these wafers.
Career Highlights
Larry R DeCamp is associated with Hollister, Inc., where he continues to innovate and develop new technologies. His work has been instrumental in advancing adhesive wafer technology, which is crucial for various medical applications.
Collaborations
DeCamp has collaborated with notable coworkers such as Ronald S Botten and Calla K Stoick, contributing to a dynamic team focused on innovation in adhesive technologies.
Conclusion
Larry R DeCamp's contributions to adhesive technology through his patents and work at Hollister, Inc. highlight his role as a significant inventor in the field. His innovative designs continue to influence the industry and improve product functionality.