Larry Lee Jordan

Title: Innovations of Larry Lee Jordan

Introduction

Larry Lee Jordan is a notable inventor based in Kokomo, IN (US). He has made significant contributions to the field of technology, particularly in the area of wafer bonding processes. With a total of 5 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is titled "Glass frit wafer bonding process and packages formed thereby." This innovative method focuses on bonding wafers using glass frit material, which minimizes the width of the glass bond line between the wafers. By reducing the amount of glass frit material used, the overall size of the package can be minimized. The invention also includes the use of storage regions defined by walls adjacent to the glass bond line, which accommodate excess glass frit material without significantly increasing the bond line width. This ensures adequate flow of glass frit material around electrical runners that cross the bond line, enhancing the efficiency of the packaging process.

Career Highlights

Throughout his career, Larry has worked with prominent companies such as Delphi Technologies, Inc. and Hughes Electronics Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Larry has collaborated with several talented individuals, including Ruth Ellen Beni and Douglas A. Knapp. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Larry Lee Jordan's contributions to the field of wafer bonding and packaging processes demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving efficiency and reducing size in electronic packaging, making him a significant figure in the industry.