Shenzhen, China

Larry Lai

This inventor holds 1 USPTO granted patent. Top assignee: Harman International Industries, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Larry Lai. Retrieved from https://idiyas.com/inventor/larry-lai-oanxphd5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovations of Larry Lai

Introduction

Larry Lai is an accomplished inventor based in Shenzhen, China. He is known for his contributions to the field of audio technology, particularly in the development of loudspeakers. With a focus on innovation, Larry has made significant strides in enhancing sound quality and performance.

Latest Patents

Larry Lai holds a patent for a loudspeaker, showcasing his expertise in audio engineering. This patent reflects his commitment to advancing sound technology and improving user experiences in various audio applications. He has 1 patent to his name, which highlights his innovative contributions to the industry.

Career Highlights

Larry is currently employed at Harman International Industries, Inc., a leading company in connected car technology, lifestyle audio, and IoT solutions. His role at Harman allows him to work on cutting-edge projects that push the boundaries of audio technology. His work has been instrumental in developing products that enhance sound quality and user satisfaction.

Collaborations

Larry has collaborated with talented professionals in his field, including Dario Distefano and Jong-Ron Lo. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Larry Lai is a notable inventor whose work in loudspeaker technology has made a significant impact in the audio industry. His dedication to innovation and collaboration continues to drive advancements in sound technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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