Larry D Hobson

Title: Larry D. Hobson: Innovator in Integrated Circuit Technology

Introduction

Larry D. Hobson is a notable inventor based in Tucson, AZ, who has made significant contributions to the field of integrated circuit technology. With a total of 2 patents to his name, Hobson has developed innovative methods that enhance the performance and efficiency of electronic components.

Latest Patents

Hobson's latest patents include a low temperature coefficient leadframe and a method of making plastic encapsulated multichip hybrid integrated circuits. The latter patent describes a process that involves bonding an insulative film to a lead frame flag, with specific areas designated for different integrated circuit chips. This method allows for the efficient bonding of low power MOS chips and high power bipolar chips, connecting them through bonding wires to various metallized strips on the insulative film. The entire assembly is then encapsulated in plastic through transfer molding, ensuring durability and reliability in electronic applications.

Career Highlights

Throughout his career, Larry D. Hobson has worked with prominent companies such as Burr-Brown Corporation and Texas Instruments Tucson Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in the electronics industry.

Collaborations

Hobson has collaborated with various professionals in his field, including his coworker R. Mark Stitt, II. These collaborations have played a crucial role in the development of his innovative technologies.

Conclusion

Larry D. Hobson's contributions to integrated circuit technology through his patents and career achievements highlight his importance as an inventor. His work continues to influence the electronics industry, paving the way for future innovations.