Guangdong, China

Lanyue Dou

This inventor holds 1 USPTO granted patent. Top assignee: Shenzhen Hfc Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lanyue Dou. Retrieved from https://idiyas.com/inventor/lanyue-dou-2emd1zo5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Lanyue Dou - Innovator in Graphene Technology

Introduction

Lanyue Dou is a prominent inventor based in Guangdong, China. He has made significant contributions to the field of electronic product heat dissipation components. His innovative work focuses on the development of advanced materials that enhance thermal conductivity.

Latest Patents

Lanyue Dou holds a patent for a "Graphene thermally conductive gasket edge-wrapped process and edge-wrapped graphene thermally conductive gasket." This invention relates specifically to improving heat dissipation in electronic devices. The process involves several steps, including coating a layer of adhesive on the first layer of graphene film, stacking additional layers, and creating a graphene film block. The final product features a specified thickness and an edge-wrapped layer for enhanced performance.

Career Highlights

Lanyue Dou is associated with Shenzhen HFC Co., Ltd., where he continues to push the boundaries of graphene technology. His work has garnered attention for its potential applications in various electronic products, making him a key figure in the industry.

Collaborations

Lanyue Dou collaborates with talented individuals such as Yong Cao and Aixiang Sun. Together, they contribute to the advancement of innovative solutions in the field of thermal management.

Conclusion

Lanyue Dou's contributions to graphene technology exemplify the importance of innovation in electronic product design. His patented processes and collaborative efforts position him as a leading inventor in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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