Lan Yit Ong

Title: Lan Yit Ong: Innovator in Semiconductor Technology

Introduction

Lan Yit Ong is a notable inventor based in Selangor, Malaysia. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the efficiency of semiconductor devices.

Latest Patents

Lan Yit Ong holds a patent for a "Substrate with corner cut-outs and semiconductor device assembled therewith." This invention involves a semiconductor device that is assembled from a rectangular substrate sheet. The substrate sheet features die mounting pads accessible from one side and package mounting pads accessible from the opposite side. The corner regions of the substrate sheet have receding edges, allowing for a more efficient design. A semiconductor die is attached to the substrate sheet, ensuring that the electrodes or bonding pads of the die are mounted to the respective die mounting pads. An encapsulating material covers both the semiconductor die and the first side of the substrate sheet, with corner covering sections of the encapsulating material further covering the receding edges of the corner regions.

Career Highlights

Lan Yit Ong is currently employed at Freescale Semiconductor, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in various electronic devices.

Collaborations

Lan has collaborated with talented individuals such as Wai Keong Wong and Yi Mei Leow, who contribute to the dynamic environment at Freescale Semiconductor, Inc.

Conclusion

Lan Yit Ong's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work not only enhances the efficiency of semiconductor devices but also showcases the importance of collaboration in driving technological progress.