The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Feb. 12, 2014
Applicants:

Wai Keong Wong, Shah Alam, MY;

Yi Mei Leow, Petaling Jaya, MY;

Lan Yit Ong, Selangor, MY;

Inventors:

Wai Keong Wong, Shah Alam, MY;

Yi Mei Leow, Petaling Jaya, MY;

Lan Yit Ong, Selangor, MY;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/56 (2013.03); H01L 24/83 (2013.01); H01L 2924/1515 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1815 (2013.01);
Abstract

A semiconductor device is assembled from a rectangular substrate sheet. The substrate sheet has die mounting pads accessible from a first side and package mounting pads accessible from an opposite side. Corner regions of the substrate sheet have receding edges. A semiconductor die is attached to the substrate sheet such that electrodes or bonding pads of the die are mounted to respective die mounting pads of the substrate sheet. An encapsulating material covers the semiconductor die and the first side of the substrate sheet. Corner covering sections of the encapsulating material further cover the receding edges of the corner regions.


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